The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 1996
Filed:
Apr. 14, 1995
Thomas J Massingill, Scotts Valley, CA (US);
William M Loh, Sunnyvale, CA (US);
Digital Equipment Corporation, Maynard, MA (US);
Abstract
A semiconductor chip having a number of bonding pads on one face is mounted on a set of matching, mirror-image bonding pads on a packaging substrate, in a flip chip configuration. An alignment template is formed on and permanently secured to the substrate, and takes the form of a frame surrounding the substrate bonding pads. The height of the template is sufficient to receive the edges of the chip and hold the chip in place while the assembly is being transported to the soldering operation. No alignment operation is required, since the chip is merely placed in the receptacle formed by the template. The template is of course aligned with the substrate bonding pads when the template is created. The template can be formed on the substrate using photolithographic techniques, and, preferably, the template itself is formed of a photo-definable material.