The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Apr. 01, 2005
Applicant:
Thomas Joel Massingill, Scotts Valley, CA (US);
Inventor:
Thomas Joel Massingill, Scotts Valley, CA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package is disclosed for an integrated circuit die (). The integrated circuit die is electrically connected to the package substrate by either die solder balls (), or wirebonds (). The package substrate (), a single sided printed wiring board, has a thick metal core (), consisting of a base metal, a core capacitor, and one or more thin build up layers.