The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
Nov. 19, 2003
Applicant:
Thomas Joel Massingill, Scotts Valley, CA (US);
Inventor:
Thomas Joel Massingill, Scotts Valley, CA (US);
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package is disclosed with a recess () for an integrated circuit die (). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit die. The integrated circuit die is electrically connected to the package substrate by either wirebonds (), TAB or die solder balls (). The package substrate (), a single sided printed wiring board, has a thick metal core () and one or more thin build up layers.