William T Chou

This inventor holds 38 USPTO granted patents and 1 published patent application, primarily in Opto-Electronic Substrates. Top assignee: Fujitsu Corporation. Active years: 1994-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William T Chou. Retrieved from https://idiyas.com/inventor/william-t-chou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38 (Patent Applications = 1)

% Patents Active = 94.7

Average Co-Inventor Count = 4.4

ph-index = 22

Forward Citations = 1,985(Granted Patents)

Company Filing History:

38 out of 39,374

Fujitsu Corporation

patents

Years Active: 1994-2005

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Areas of Expertise:

Opto-Electronic Substrates

High-Density Interposers

Multichip Modules

Electrical Interconnections

Optical Interconnections

Thin Film Capacitors

Wire Interconnect Structures

Planarizing Structures

Electroplating Vias

Fabrication Procedures

Signal Interposer

Chemical Processing Techniques

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6845184 - Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making (2005-01-18),

2. 6733685 - Methods of planarizing structures on wafers and substrates by polishing (2004-05-11),

3. 6690845 - Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making (2004-02-10),

4. 6662443 - Method of fabricating a substrate with a via connection (2003-12-16),

5. 6611635 - Opto-electronic substrates with electrical and optical interconnections and methods for making (2003-08-26),

6. 6343171 - Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making (2002-01-29),

7. 6239485 - Reduced cross-talk noise high density signal interposer with power and ground wrap (2001-05-29),

8. 6226171 - Power conducting substrates with high-yield integrated substrate capacitor (2001-05-01),

9. 6221567 - Method of patterning polyamic acid layers (2001-04-24),

10. 6197664 - Method for electroplating vias or through holes in substrates having conductors on both sides (2001-03-06),

11. 6187652 - Method of fabrication of multiple-layer high density substrate (2001-02-13),

12. 6102710 - Controlled impedance interposer substrate and method of making (2000-08-15),

13. 6081026 - High density signal interposer with power and ground wrap (2000-06-27),

14. 6039889 - Process flows for formation of fine structure layer pairs on flexible (2000-03-21),

15. 5942373 - Pattern or via structure formed through supplemental electron beam (1999-08-24),

Title: The Innovative Journey of William T Chou

Introduction: William T Chou, a visionary inventor based in Cupertino, CA, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: William T Chou holds several patents in the field of artificial intelligence and machine learning, with his most recent patent focusing on advanced robotics for healthcare applications.

Career Highlights: With a background in computer science and engineering, William T Chou has a successful career working for leading tech companies in Silicon Valley, where he honed his skills in innovation and problem-solving.

Collaborations: Throughout his career, William T Chou has collaborated with top researchers and engineers from renowned universities and research institutions, fostering a culture of creativity and excellence in his projects.

Conclusion: William T Chou's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the field of inventions. His work continues to inspire future generations of inventors and innovators worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: