The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2006

Filed:

Jul. 30, 2003
Applicants:

Motoaki Tani, Kawasaki, JP;

Nobuyuki Hayashi, Kawasaki, JP;

Tomoyuki Abe, Kawasaki, JP;

Yasuhito Takahashi, Kawasaki, JP;

Takashi Shuto, Kawasaki, JP;

Inventors:

Motoaki Tani, Kawasaki, JP;

Nobuyuki Hayashi, Kawasaki, JP;

Tomoyuki Abe, Kawasaki, JP;

Yasuhito Takahashi, Kawasaki, JP;

Takashi Shuto, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer wiring board is composed of a core portion, a first wiring portion and a second wiring portion. The core portion includes a core insulating layer containing a carbon fiber material. The first wiring portion is bonded to the core portion and has a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth. The second wiring portion is bonded to the first wiring portion and has a laminated structure including at least a second insulating layer and a second wiring pattern. The core portion, the first wiring portion and the second wiring portion are arranged in a stack.


Find Patent Forward Citations

Loading…