Yasuhiro Okuda

This inventor holds 24 USPTO granted patents and 5 published patent applications, plus 2 CIPO patents and 5 EPO patents, primarily in Conductive Materials. Top assignees: Sumitomo Electric Industries, Limited, Sumitomo Electric Printed Circuits, Inc., Vascular Craft Research Center Co., Ltd.. Active years: 1993-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuhiro Okuda. Retrieved from https://idiyas.com/inventor/yasuhiro-okuda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 (Patent Applications = 5)

% Patents Active = 41.7

CIPO Patents = 2

EPO Patents = 5 (Patent Applications = 1)

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 227(Granted Patents)

Company Filing History:

22 out of 10,641

Sumitomo Electric Industries, Limited

patents

3 out of 100

Sumitomo Electric Printed Circuits, Inc.

patents

1 out of 1

Vascular Craft Research Center Co., Ltd.

patent

4. 1 out of 1

Vascular Graft Research Center Co., Ltd.

patent

where one patent can have more than one assignee

Years Active: 1993-2025

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Areas of Expertise:

Porous Membrane

Dielectric Sheet

Metal Powder

Redox Flow Cell

Printed Circuit Board

Conductive Adhesive

Optoelectric Module

Anisotropic Conductive Film

Expanded PTFE Film

Prosthesis

Photosetting Resin

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12246292 - Micro or nano porous membrane, manufacturing method of same, porous resin membrane complex, and filter element (2025-03-11),

2. 12213249 - Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board (2025-01-28),

3. 10307825 - Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder (2019-06-04),

4. 10096855 - Redox flow cell membrane (2018-10-09),

5. 9967976 - Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board (2018-05-08),

6. 9226406 - Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device (2015-12-29),

7. 8507803 - Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity (2013-08-13),

8. 8506750 - Composite structure and process for producing the same (2013-08-13),

9. 8470438 - Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus (2013-06-25),

10. 8268182 - Product having through-hole and laser processing method (2012-09-18),

11. 8235603 - Optoelectric conversion module, method for assembling same, and optoelectric information processor using same (2012-08-07),

12. 8147911 - Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive. (2012-04-03),

13. 8133412 - Anisotropic conductive film (2012-03-13),

14. 7976751 - Expanded porous polytetrafluoroethylene film having elastic recovery property in thickness-wise direction of the film, production process thereof, and use of the porous film (2011-07-12),

15. 7887899 - Anisotropic conductive sheet, production method thereof, connection method and inspection method (2011-02-15),

Title: Innovations and Contributions of Yasuhiro Okuda in Advanced Manufacturing Technologies

Introduction

Yasuhiro Okuda, a prominent inventor based in Osaka, Japan, has made significant contributions to the field of advanced manufacturing technologies. With a remarkable portfolio of 23 patents, he has been instrumental in developing innovative methods and materials that enhance the performance of electrical components.

Latest Patents

Among his latest patents, Okuda developed a method for manufacturing dielectric sheets and substrates for high-frequency printed wiring boards. One notable invention involves a unique process for creating dielectric sheets by extruding a mixture of powder polytetrafluoroethylene and spherical silica at controlled temperatures. This method ensures that the mass ratio of silica to polytetrafluoroethylene is 1.3 or greater, and the average particle diameter of silica falls between 0.1 μm and 3.0 μm. Additionally, he has designed a metal powder that showcases exceptional flexibility, along with a corresponding ink for sintering applications, emphasizing nanoparticles with highly specific size parameters.

Career Highlights

Throughout his career, Yasuhiro Okuda has collaborated with established companies such as Sumitomo Electric Industries and Sumitomo Electric Printed Circuits. These affiliations have enabled him to translate his innovative concepts into practical solutions for complex manufacturing challenges in the electronics sector.

Collaborations

Okuda has worked alongside talented colleagues like Fumihiro Hayashi and Masamichi Yamamoto, fostering a collaborative environment that fuels advancement in technology and innovation. Their combined expertise has contributed to the successful realization of several cutting-edge projects.

Conclusion

Yasuhiro Okuda’s extensive patent record and his commitment to innovating manufacturing processes position him as a key figure in the realm of electronic components. His breakthroughs in dielectric materials and metal powder formulations continue to drive advancements within the industry, showcasing the importance of inventors in shaping technological progress.

Profile summary based on public USPTO records.