The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Dec. 21, 2015
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;
Kazuhiro Miyata, Osaka, JP;
Issei Okada, Osaka, JP;
Takashi Kasuga, Osaka, JP;
Yoshio Oka, Osaka, JP;
Yasuhiro Okuda, Osaka, JP;
Jinjoo Park, Koka, JP;
Hiroshi Ueda, Koka, JP;
Kousuke Miura, Koka, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka-shi, Shiga, JP;
Abstract
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.