The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
May. 17, 2007
Applicants:
Hidehiko Mishima, Osaka, JP;
Yasuhiro Okuda, Osaka, JP;
Shuji Sakabe, Uji, JP;
Masaki Hashida, Uji, JP;
Seiji Shimizu, Uji, JP;
Inventors:
Hidehiko Mishima, Osaka, JP;
Yasuhiro Okuda, Osaka, JP;
Shuji Sakabe, Uji, JP;
Masaki Hashida, Uji, JP;
Seiji Shimizu, Uji, JP;
Assignee:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); H01B 13/00 (2006.01); B23K 26/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.