The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Mar. 12, 2010
Applicants:

Masamichi Yamamoto, Osaka, JP;

Kyouichirou Nakatsugi, Osaka, JP;

Ayao Kariya, Osaka, JP;

Katsuhiro Satou, Osaka, JP;

Yasuhiro Okuda, Osaka, JP;

Inventors:

Masamichi Yamamoto, Osaka, JP;

Kyouichirou Nakatsugi, Osaka, JP;

Ayao Kariya, Osaka, JP;

Katsuhiro Satou, Osaka, JP;

Yasuhiro Okuda, Osaka, JP;

Assignee:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boardsandelectrically connects a plurality of first electrodesandprovided to be adjacent to each other on a first boardwith a plurality of second electrodesandprovided to be adjacent to each other on a second boardthrough an adhesivethat contains conductive particlesand that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrodeand second electrodeand between the mutually facing first electrodeand second electrode, an adhesive layeris formed between the first boardand the second boardand in the adhesive layer, a cavity portionis formed between the first electrodesandand between the second electrodesand


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