IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12213249 B1

PDFFull Text
Date of Patent:
Jan. 28, 2025

Filed:

May. 11, 2021

Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board

Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Shiga, JP;

Inventors:

Shingo Kaimori, Osaka, JP;

Takashi Ninomiya, Osaka, JP;

Motohiko Sugiura, Osaka, JP;

Yasuhiro Okuda, Osaka, JP;

Hideki Kashihara, Shiga, JP;

Satoshi Kiya, Shiga, JP;

Makoto Nakabayashi, Osaka, JP;

Kentaro Okamoto, Osaka, JP;

Chiaki Tokuda, Osaka, JP;

Assignees:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;

SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Prashant J Khatri

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B29C 48/00 (2019.01); B29C 48/08 (2019.01); B32B 15/082 (2006.01); B32B 15/20 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01); B29K 27/18 (2006.01); B29K 509/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B29C 48/0011 (2019.02); B29C 48/0021 (2019.02); B29C 48/08 (2019.02); B32B 15/082 (2013.01); B32B 15/20 (2013.01); H05K 1/024 (2013.01); H05K 3/0014 (2013.01); H05K 3/022 (2013.01); B29K 2027/18 (2013.01); B29K 2509/00 (2013.01); B29K 2995/0006 (2013.01); B29L 2031/3425 (2013.01); B32B 2307/204 (2013.01); B32B 2457/08 (2013.01); H05K 3/386 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0266 (2013.01);
Abstract

A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 μm or greater but 3.0 μm or less. A reduction ratio of the extrusion molding is 8 or less.

Find Patent Forward Citations

Loading…