Osaka, Japan

Takashi Ninomiya

USPTO Granted Patents = 1 

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Takashi Ninomiya: Innovator in Dielectric Sheet Manufacturing

Introduction

Takashi Ninomiya is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the manufacturing of dielectric sheets and substrates for high-frequency printed wiring boards. His innovative methods have paved the way for advancements in electronic components.

Latest Patents

Ninomiya holds 1 patent for his invention titled "Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board." This patent describes a method for manufacturing a dielectric sheet that involves extrusion molding a mixture of powder polytetrafluoroethylene and spherical silica. The process is conducted at a temperature lower than or equal to the melting point of polytetrafluoroethylene, followed by calendering the resulting sheet body. The mass ratio of silica to polytetrafluoroethylene is specified to be 1.3 or greater, with the average particle diameter of silica ranging from 0.1 μm to 3.0 μm. The reduction ratio of the extrusion molding is capped at 8.

Career Highlights

Throughout his career, Takashi Ninomiya has worked with prominent companies such as Sumitomo Electric Industries, Limited and Sumitomo Electric Printed Circuits, Inc. His experience in these organizations has contributed to his expertise in the field of dielectric materials and high-frequency applications.

Collaborations

Ninomiya has collaborated with notable colleagues, including Shingo Kaimori and Motohiko Sugiura. Their joint efforts have further enhanced the development of innovative technologies in the industry.

Conclusion

Takashi Ninomiya's contributions to the field of dielectric sheet manufacturing exemplify the impact of innovation in technology. His patented methods continue to influence advancements in high-frequency printed wiring boards, showcasing the importance of research and development in this area.

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