The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2011

Filed:

May. 01, 2006
Applicants:

Taro Fujita, Osaka, JP;

Yasuhiro Okuda, Osaka, JP;

Tsuyoshi Haga, Hyogo, JP;

Inventors:

Taro Fujita, Osaka, JP;

Yasuhiro Okuda, Osaka, JP;

Tsuyoshi Haga, Hyogo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 3/24 (2006.01); B23B 35/00 (2006.01); H01R 43/00 (2006.01); G01M 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film () that is made of synthetic resin and that has electrically insulating property. The porous film () is provided with a plurality of holes () that are formed in the direction of thickness so that pin electrodes () can be through-hole-mounted. The inner walls of the holes () are coated with metals (). The inserted pin electrodes () become electrically continuous, through the metals (), with the surface opposite to the surface from which the pin electrodes () are inserted. It is desirable that a porous film have, at the side from which the electrodes are through-hole-mounted, a nonporous film that is made of synthetic resin and that has electrically insulating property and the nonporous film be provided with a plurality of holes that are formed in the direction of thickness so that the pin electrodes can be through-hole-mounted.


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