Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Vascular Graft Research Center Co., Ltd.

Vascular Craft Research Center Co., Ltd.

Yasuhiro Okuda

Fumihiro Hayashi

Taro Fujita

Masamichi Yamamoto

Kyouichirou Nakatsugi

Yasuhito Masuda

Tsuyoshi Haga

Hiroshi Ueda

Yoshio Oka

Kousuke Miura

Takashi Kasuga

Issei Okada

Jinjoo Park

Motomi Nakata

Mayo Uenoyama

Yuichi Idomoto

Koichiro Natori

Hirokazu Katayama

Masahiro Adachi

Akihisa Hosoe

Wataru Sakurai

Makoto Nakabayashi

Mitsuaki Tamura

Kentaro Okamoto

Hideki Matsubara

Hideki Kashihara

Yongrong Dong

Toshio Shigematsu

Shingo Kaimori

Satoshi Kiya

Kei Hanafusa

Hideaki Toshioka

Chiaki Tokuda

Takayuki Mishima

Motohiko Sugiura

Ayao Kariya

Kazuhiro Miyata

Hidehiko Mishima

Shuji Sakabe

Hiroaki Nishimoto

Masaki Hashida

Seiji Shimizu

Toshihiko Kumada

Hidehiko Miura

Naoki Shimbara

Toshiya Nishibe

Yutaka Okumura

Aya Ooya

Takashi Ninomiya

Katsuhiro Satou

The present disclosure relates to a micro or nano porous membrane composed of a stretched membrane of a fluororesin membrane, wherein the fluororesin membrane contains sintered bodies of a plurality of core-shell particles containing fluororesins, wherein the core-shell particles include cores and shells covering outer surfaces of the cores, wherein an average particle size of the core-shell particles before being sintered is greater than or equal to 100 nm and less than or equal to 1,000 nm, wherein a ratio of a volume of the shells to a volume of the cores in the core-shell particles before being sintered is greater than or equal to 2/98 and less than or equal to 50/50, wherein a fluororesin of the cores is a tetrafluoroethylene-hexafluoropropylene copolymer, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer or a combination thereof, and a fluororesin of the shells is polytetrafluoroethylene, and wherein a first heat of fusion of the fluororesins in the core-shell particles is less than or equal to 68 J/g.

Micro or nano porous membrane, manufacturing method of same, porous resin membrane complex, and filter element

A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 μm or greater but 3.0 μm or less. A reduction ratio of the extrusion molding is 8 or less.

Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board

An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size Dof 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size Dof 20 nm or less as determined by an X-ray analysis, and a ratio (D/D) of the mean crystallite size Dto the mean particle size Dof less than 0.4.

Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder

A redox flow cell membrane includes a porous membrane that has a mean flow pore size of not more than 100 nm, that has a thickness of not more than 500 &#x3bc;m, and that has an air flow rate of not less than 0.1 ml/s&#xb7;cm. When the redox flow cell membrane is used for a V&#x2014;V-based redox flow cell, the porous membrane preferably has a mean flow pore size of not more than 30 nm.

Redox flow cell membrane

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrodeand a second connecting electrodeare connected together through a conductive adhesivethat is interposed between the electrodes, includes an organic film formation step in which an organic filmis formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device

A composite structure comprising two polytetrafluoroethylene porous layers and a framework structural member having a plurality of gaps or openings, the framework structural member being disposed between the two polytetrafluoroethylene porous layers, wherein the composite structure is structured such that the polytetrafluoroethylene porous layers are united together by being adhered with each other through the gaps or openings of the framework structural member and such that the respective polytetrafluoroethylene porous layers (A1) and (A2) are united with the framework structural member closely along the surfaces of the respective constituent elements of the framework structural member in such a manner as to wrap the respective elements. The method of manufacturing the composite structure is characterized in that it includes a step of applying pressure through a mass of fine particles.

Composite structure and process for producing the same

The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boardsandelectrically connects a plurality of first electrodesandprovided to be adjacent to each other on a first boardwith a plurality of second electrodesandprovided to be adjacent to each other on a second boardthrough an adhesivethat contains conductive particlesand that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrodeand second electrodeand between the mutually facing first electrodeand second electrode, an adhesive layeris formed between the first boardand the second boardand in the adhesive layer, a cavity portionis formed between the first electrodesandand between the second electrodesand

Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity

There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrodeand a second connection electrodeare connected to each other with a conductive adhesive layertherebetween includes organic filmsandformed on at least the first connection electrode and conductive particlescontained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.

Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus

A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

Product having through-hole and laser processing method

An object is to obtain a module in which an optical fiber can be inserted after a ferrule has been mounted on a circuit board. There is provided an optical module () in which at least a ferrule () and an electric component () are mounted on a circuit board () on which external electrodes () have been mounted; a fiber through-hole is formed in the ferrule () in a position in which the optoelectric conversion device () is mounted on one end surface and that corresponds to an active layer of an optoelectric conversion device (); and the optoelectric conversion device () of the ferrule () is electrically connected to the electric component (). In the ferrule (), an opening in the one end face of the fiber through-hole that faces the optoelectric conversion device () is blocked by a transparent substance (), and a portion that excludes the fiber through-hole at the other end surface is are monolithically covered with a molding resin ().

Optoelectric conversion module, method for assembling same, and optoelectric information processor using same

A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.

Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.

An anisotropic conductive filmcontains electrically conductive particlesdispersed in an adhesive agentfor electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100&#xb0; C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90&#xb0; C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 &#x3bc;m or less, when electrodes are connected with the anisotropic conductive film.

Anisotropic conductive film

An expanded porous polytetrafluoroethylene film having residual strain of at most 11.0% as measured after a load required to indent a rod, which is in a columnar form that its outer diameter is at least 2 mm and at least 1.9 times as much as the thickness of the film, and has a smooth plane perpendicular to its axis at a free end surface thereof and a modulus of longitudinal elasticity of at least 1.0&#xd7;10kgf/mm, up to 20% of the film thickness at a strain rate of 100%/min from the free end surface is applied repeatedly 20 times, and a production process of the porous film, in which a step of compressing an expanded porous polytetrafluoroethylene film having a high draw ratio is provided.

Expanded porous polytetrafluoroethylene film having elastic recovery property in thickness-wise direction of the film, production process thereof, and use of the porous film

The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film () that is made of synthetic resin and that has electrically insulating property. The porous film () is provided with a plurality of holes () that are formed in the direction of thickness so that pin electrodes () can be through-hole-mounted. The inner walls of the holes () are coated with metals (). The inserted pin electrodes () become electrically continuous, through the metals (), with the surface opposite to the surface from which the pin electrodes () are inserted. It is desirable that a porous film have, at the side from which the electrodes are through-hole-mounted, a nonporous film that is made of synthetic resin and that has electrically insulating property and the nonporous film be provided with a plurality of holes that are formed in the direction of thickness so that the pin electrodes can be through-hole-mounted.

Anisotropic conductive sheet, production method thereof, connection method and inspection method

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Osaka, Japan

Yasuhiro Okuda