The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Jun. 04, 2010
Applicants:

Masamichi Yamamoto, Osaka, JP;

Kyouichirou Nakatsugi, Osaka, JP;

Yasuhiro Okuda, Osaka, JP;

Inventors:

Masamichi Yamamoto, Osaka, JP;

Kyouichirou Nakatsugi, Osaka, JP;

Yasuhiro Okuda, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/04 (2006.01); H05K 3/32 (2006.01); C09J 9/02 (2006.01); H05K 3/36 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/323 (2013.01); C09J 9/02 (2013.01); H05K 3/361 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H05K 3/282 (2013.01); H05K 2201/023 (2013.01); H05K 2201/0379 (2013.01); Y10T 156/10 (2015.01);
Abstract

By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrodeand a second connecting electrodeare connected together through a conductive adhesivethat is interposed between the electrodes, includes an organic film formation step in which an organic filmis formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.


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