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For the Inventor, By the Inventor

San Diego, CA, United States of America

Yangyang Sun

USPTO Granted Patents = 16 

 

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Boise, ID (US) (2013 - 2015)
  • San Diego, CA (US) (2014 - 2024)

Company Filing History:

goldMedal11 out of 41,498 
 
Qualcomm Incorporated
 patents
silverMedal4 out of 37,972 
 
Micron Technology Incorporated
 patents
where one patent can have more than one assignee

Years Active: 2013-2025

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16 patents (USPTO):Explore Patents
1. 12500188 - Flip-chip bumping metal layer and bump structure (2025-12-16),
2. 12500187 - Package comprising an interconnection die located between substrates (2025-12-16),
3. 12469811 - Package comprising wire bonds coupled to integrated devices (2025-11-11),
4. 12463127 - Integrated circuit (IC) package employing a re-distribution layer (RDL) substrate(s) with photosensitive dielectric layer(s) for increased package rigidity, and related fabrication methods (2025-11-04),
5. 12355000 - Package comprising a substrate and a high-density interconnect integrated device (2025-07-08),
6. 12113038 - Thermal compression flip chip bump for high performance and fine pitch (2024-10-08),
7. 11948909 - Package comprising spacers between integrated devices (2024-04-02),
8. 11676922 - Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer (2023-06-13),
9. 11557557 - Flip-chip flexible under bump metallization size (2023-01-17),
10. 11417622 - Flip-chip device (2022-08-16),
11. 11380613 - Repurposed seed layer for high frequency noise control and electrostatic discharge connection (2022-07-05),
12. 10325979 - High density and reliable vertical natural capacitors (2019-06-18),
13. 9362143 - Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages (2016-06-07),
14. 9123700 - Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias (2015-09-01),
15. 8872356 - Semiconductor structures comprising a dielectric material having a curvilinear profile (2014-10-28),

Title: Yangyang Sun: Pioneering Inventor from San Diego

Introduction: Yangyang Sun is a distinguished inventor based in San Diego, CA, known for his groundbreaking contributions to various technological fields.

Latest Patents: Yangyang Sun holds several patents in the areas of renewable energy, artificial intelligence, and biotechnology, showcasing his versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Yangyang Sun has worked with leading tech companies, research institutions, and universities, consistently pushing the boundaries of innovation.

Collaborations: Throughout his career, Yangyang Sun has collaborated with top scientists, engineers, and researchers globally, fostering a culture of creativity and excellence in his projects.

Conclusion: Yangyang Sun's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs.

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