The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Dec. 01, 2023
Qualcomm Incorporated, San Diego, CA (US);
Wei Hu, San Diego, CA (US);
Dongming He, San Diego, CA (US);
Zhaozhi Li, San Diego, CA (US);
Yangyang Sun, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
A die includes a plurality of pillar bumps configured to electrically connect the die to a substrate. The plurality of pillar bumps includes at least one first pillar bump having a first total pillar bump height. The at least one first pillar bump includes a first pillar having a first pillar height and a first solder cap having a first solder cap height. The plurality of pillar bumps includes at least one second pillar bump having a second pillar height substantially equal to the first total pillar bump height. The at least one second pillar bump includes a second pillar having a second pillar height and a second solder cap having a second solder cap height. The second pillar height is greater than the first pillar height, and the second solder cap height is less than the first solder cap height.