The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Jan. 31, 2024
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Yangyang Sun, San Diego, CA (US);

Yue Li, San Diego, CA (US);

Lily Zhao, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/20 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 20/20 (2026.01); H10W 90/00 (2026.01); H10W 72/859 (2026.01); H10W 90/722 (2026.01); H10W 90/754 (2026.01);
Abstract

A stacked IC device includes a first memory die and a second memory die coupled to the substrate. The stacked IC device also includes a logic die electrically connected, face-to-face, to the first memory die and the second memory die and electrically connected to the substrate by conductors that extend through a region between the first memory die and the second memory die.


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