Yangang Wang

Title: The Innovations of Yangang Wang

Introduction

Yangang Wang is a notable inventor based in Lincolnshire, GB. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and safety of semiconductor devices.

Latest Patents

One of Yangang Wang's latest patents is a semiconductor device that features a unique housing design. This device includes a first and second housing electrode positioned at opposite sides, with a tubular housing element that electrically isolates them. Additionally, it contains at least one semiconductor chip situated between these electrodes and a metal explosion shield that surrounds the chip, providing enhanced protection. Another significant patent is for a high power density 3D semiconductor module packaging. This invention describes a semiconductor device sub-assembly that comprises at least two power semiconductor devices arranged on either side of a contact of a first type, optimizing the arrangement for better performance.

Career Highlights

Yangang Wang has worked with prominent companies in the semiconductor industry, including Dynex Semiconductor Limited and Zhuzhou CRRC Times Electric Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Throughout his career, Yangang has collaborated with talented individuals such as Haihui Luo and Guoyou Liu. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Yangang Wang's contributions to semiconductor technology are noteworthy, with several patents that reflect his innovative spirit. His work continues to influence the industry and pave the way for future advancements.