The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
May. 28, 2021
Dynex Semiconductor Limited, Lincoln, GB;
Zhuzhou Crrc Times Semiconductor Co. Ltd, Zhuzhou, CN;
Robin Adam Simpson, Lincoln, GB;
Yangang Wang, Lincoln, GB;
DYNEX SEMICONDUCTOR LIMITED, Lincoln, GB;
ZHUZHOU CRRC TIMES SEMICONDUCTOR CO. LTD, Zhuzhou, CN;
Abstract
There is provided a semiconductor device, comprising: a housing comprising a housing electrode; and at least one semiconductor chiparranged within the housing; wherein the housing electrodecomprises a deformable portion, and the deformable portionis configured to deform when a pressure difference between an interior and an exterior of the housing exceeds a threshold differential pressure or a temperature at the deformable portion exceeds a threshold temperature, so as to transform the housing from a hermetically sealed housing to an open housing in fluid communication with the exterior.