The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jul. 19, 2021
Dynex Semiconductor Limited, Lincoln, GB;
Zhuzhou Crrc Times Semiconductor Co. Ltd, Zhuzhou, CN;
Robin Adam Simpson, Lincoln, GB;
Yangang Wang, Lincoln, GB;
DYNEX SEMICONDUCTOR LIMITED, Lincoln, GB;
ZHUZHOU CRRC TIMES SEMICONDUCTOR CO. LTD, Zhuzhou, CN;
Abstract
A semiconductor device is provided and includes a housing having first and second opposing housing electrodes and semiconductor units within the housing and coupled to the housing electrodes by pressure. The first housing electrode includes an electrode plate. A thermal coupler is provided between the semiconductor units and the electrode plate. A first array of pillars extend between the semiconductor units and the thermal coupler. A second array of pillars extend between the thermal coupler and the electrode plate. The semiconductor units are electrically coupled to the electrode plate via the first and second arrays of pillars. The thermal coupler extends between at least some of the first array of pillars so as to thermally couple the at least some of the first array of pillars to one another.