The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Apr. 20, 2021
Dynex Semiconductor Limited, Lincoln, GB;
Zhuzhou Crrc Times Semiconductor Co. Ltd, Zhuzhou, CN;
Yangang Wang, Lincoln, GB;
Bruno Cerqueira Rente Ribeiro, London, GB;
Paul Durnford Taylor, Lincoln, GB;
Robin Adam Simpson, Lincoln, GB;
Callum Tarr, Lincoln, GB;
Michael David Nicholson, Lincoln, GB;
Daniel Bell, Lincoln, GB;
Tong Sun, London, GB;
Kenneth Grattan, London, GB;
Matthias Fabian, London, GB;
DYNEX SEMICONDUCTOR LIMITED, Lincolnshire, GB;
ZHUZHOU CRRC TIMES SEMICONDUCTOR CO. LTD, Hunan, CN;
Abstract
There is provided a semiconductor device, comprising: at least one semiconductor chip, and a structurethermally coupled to the at least one semiconductor chip, wherein the structurecomprises a surface located within an interior of the semiconductor device, and the surface comprises a groove; and a sensorcomprising an optical fibrepassing through the groove, wherein the sensoris configured to sense a temperature of the at least one semiconductor chip