The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

May. 28, 2021
Applicants:

Dynex Semiconductor Limited, Lincoln, GB;

Zhuzhou Crrc Times Semiconductor Co. Ltd, Zhuzhou, CN;

Inventors:

Robin Adam Simpson, Lincoln, GB;

Michael David Nicholson, Lincoln, GB;

Yangang Wang, Lincoln, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 42/00 (2026.01); H10W 70/20 (2026.01); H10W 72/30 (2026.01); H10W 76/12 (2026.01); H10W 76/138 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 42/121 (2026.01); H10W 70/20 (2026.01); H10W 76/12 (2026.01); H10W 76/138 (2026.01); H10W 72/352 (2026.01); H10W 90/736 (2026.01);
Abstract

There is provided a semiconductor device, comprising: a housing comprising a first housing electrodeand a second housing electrodearranged at opposite sides of the housing; and a plurality of semiconductor unitsarranged within the housing between the first and second housing electrodesand coupled to at least one of the first and second housing electrodesby pressure, wherein the plurality of semiconductor unitscomprise a first semiconductor unit-and a second semiconductor unit-neighbouring the first semiconductor unit-; wherein the first and/or second housing electrode comprises a plurality of pillars, and the plurality of pillars comprise a first pillar-and a second pillar-electrically coupled to the first and second semiconductor units--, respectively, and wherein a surfaceof the first housing electrodecomprises a groove, and a width Wof the grooveis less than a spacing Sbetween the first pillar-and the second pillar-


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