The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Jul. 19, 2021
Applicants:

Dynex Semiconductor Limited, Lincoln, GB;

Zhuzhou Crrc Times Semiconductor Co. Ltd, Zhuzhou, CN;

Inventors:

Robin Adam Simpson, Lincoln, GB;

Yangang Wang, Lincoln, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 23/562 (2013.01);
Abstract

The present disclosure provides a semiconductor device that includes a housing having an internal space, at least one semiconductor chip arranged inside the housing, and a separator arranged inside the housing and configured to separate the internal space of the housing into a first chamber and a second chamber. The at least one semiconductor chip is arranged within the first chamber. The separator includes a deformable portion that is configured to deform when a pressure difference between the first and second chambers exceeds a threshold differential pressure or when a temperature at the deformable portion exceeds a threshold temperature, so as to transform the first chamber from a hermetically sealed chamber to an open chamber in fluid communication with the second chamber.


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