Northford, CT, United States of America

Xuan Lin



Average Co-Inventor Count = 4.7

ph-index = 9

Forward Citations = 170(Granted Patents)


Location History:

  • Rolla, MO (US) (1999)
  • Orange, CT (US) (2004 - 2006)
  • New Haven, CT (US) (2008)
  • Watervliet, NY (US) (2014 - 2017)
  • Northford, CT (US) (2007 - 2022)

Company Filing History:


Years Active: 1999-2022

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):

Title: Xuan Lin: Innovator Extraordinaire Pushing the Boundaries of Technology

Introduction:

Throughout his illustrious career, Xuan Lin has consistently demonstrated a passion for innovation and technological advancements. Hailing from Northford, CT, in the United States, Xuan has made significant contributions to the field of microelectronics, particularly in the areas of copper electrodeposition and via filling processes. His groundbreaking inventions and patents have earned him recognition from industry experts and the general public alike.

Latest Patents:

Xuan Lin's latest patents showcase his expertise in the field of microelectronics. His innovative approach to copper electrodeposition in microelectronics has resulted in a novel electrolytic plating method and composition. By employing a suppressor compound with polyether groups, Xuan has effectively achieved rapid bottom-up deposition, ensuring superior copper deposition on vertical surfaces compared to the side walls.

Another notable invention by Xuan is his process for filling vias in microelectronics. By skillfully reversing the polarity of the circuit and applying anodic potential, Xuan has enabled the copper filling of through silicon via features in semiconductor integrated circuit devices. This ingenious approach optimizes copper deposition within the via, leading to enhanced performance and conductivity.

Career Highlights:

Xuan Lin's career is adorned with remarkable milestones that highlight his commitment to pushing technological boundaries. Over the years, he has amassed an impressive total of 22 patents, each contributing to the advancement of microelectronics. His meticulous attention to detail and innovative mindset have established him as a prominent figure in the field.

Collaborations:

Throughout his journey, Xuan Lin has collaborated with renowned organizations in the industry to further his research and development. Notably, he has worked with Enthone Incorporated, a leading provider of specialty chemicals and coatings for advanced technology applications. His contributions to the company's research efforts have been instrumental in driving innovation in the microelectronics sector.

Additionally, Xuan has partnered with The Curators of the University of Missouri, where he continues to contribute to cutting-edge research projects. These collaborations demonstrate Xuan's dedication to expanding the frontiers of knowledge by working alongside esteemed colleagues.

Conclusion:

Xuan Lin's exceptional talent and unwavering dedication to technological advancements have firmly established him as an innovator extraordinaire. His groundbreaking inventions in the field of microelectronics, including novel copper electrodeposition methods and via filling processes, have garnered attention and acclaim from industry experts and the general public alike.

Through his collaborations with prominent organizations, Xuan has further solidified his position as a leading figure in the innovative realm of microelectronics. With his exceptional career achievements and continued pursuit of groundbreaking solutions, Xuan Lin stands as a testament to the transformative power of human ingenuity and the boundless possibilities of technological innovation.

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