The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Oct. 17, 2007
Xuan Lin, Northford, CT (US);
Richard Hurtubise, Clinton, CT (US);
Vincent Paneccasio, Madison, CT (US);
Qingyun Chen, Branford, CT (US);
Xuan Lin, Northford, CT (US);
Richard Hurtubise, Clinton, CT (US);
Vincent Paneccasio, Madison, CT (US);
Qingyun Chen, Branford, CT (US);
Enthone Inc., New Haven, CT (US);
Abstract
A method for plating copper onto a semiconductor integrated circuit device substrate by forming an initial metal deposit in the feature which has a profile comprising metal on the bottom of the feature and a segment of the sidewalls having essentially no metal thereon, electrolessly depositing copper onto the initial metal deposit to fill the feature with copper. A method for plating copper onto a semiconductor integrated circuit device substrate by forming a deposit comprising a copper wettable metal in the feature, forming a copper-based deposit on the top-field surface, and depositing copper onto the deposit comprising the copper wettable metal to fill the feature with copper.