The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Jul. 08, 2014
Applicant:
Enthone Inc., West Haven, CT (US);
Inventors:
Vincent Paneccasio, Jr., Madison, CT (US);
Xuan Lin, Watervliet, NY (US);
Richard Hurtubise, Clinton, CT (US);
Qingyun Chen, Branford, CT (US);
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 3/38 (2006.01); H05K 3/42 (2006.01); H01L 21/768 (2006.01); C25D 7/12 (2006.01); H01L 21/288 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 7/12 (2013.01); H01L 21/2885 (2013.01); H01L 21/76877 (2013.01); H01L 23/53228 (2013.01); C25D 7/123 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.
Paneccasio, Jr., Vincent. (2017). Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers (U.S. Patent No. 9613858). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9613858
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile