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Waterbury, CT, United States of America

Macdermid Enthone Gmbh

USPTO Granted Patents = 41

EPO Patents = 38

Trademarks = 38

Forward Citations = 9

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61 inventors (with patents filed for the assignee):

Kyle M Whitten (15 out of 15 patents)

Vincent Paneccasio, Jr (12 out of 38 patents)

Thomas B Richardson (12 out of 19 patents)

4. Shaopeng Sun (9 out of 9 patents)

5. Elie H Najjar (9 out of 13 patents)

6. John Commander (6 out of 8 patents)

7. Jianwen Han (6 out of 6 patents)

8. Wenbo Shao (6 out of 6 patents)

9. Richard W Hurtubise (6 out of 29 patents)

10. Ernest Long (5 out of 12 patents)

11. Richard A Bellemare (5 out of 8 patents)

12. Eric Yakobson (5 out of 15 patents)

13. Stephan I Braye (4 out of 4 patents)

14. Andreas Konigshofen (4 out of 5 patents)

15. Fengting Xu (3 out of 4 patents)

Core Competencies:

Electrolytic Method

Copper Deposition

Interconnects

Microelectronics

Nickel Plating

Ozone-Etched Plastics

Nanotwinned Copper

Cobalt Chemistry

Wafer Level Packaging

Corrosion Protection

Flexible Substrates

Conductive Polymers

41 patents: Sort by Forward Citations

1. 12635082 - Single step electrolytic method of filling through-holes in printed circuit boards and other substrates (2026-05-19),

2. 12553134 - Bendable nickel plating on flexible substrates (2026-02-17),

3. 12540404 - Method for improving adhesion between metallization layers and ozone-etched plastics (2026-02-03),

4. 12398480 - Leveler compositions for use in copper deposition in manufacture of microelectronics (2025-08-26),

5. 12325927 - Complex waveform for electrolytic plating (2025-06-10),

6. 12270121 - Composition and method for fabrication of nickel interconnects (2025-04-08),

7. 12157944 - Method and wet chemical compositions for diffusion barrier formation (2024-12-03),

8. 11873568 - Compositions and methods for the electrodeposition of nanotwinned copper (2024-01-16),

9. 11846018 - Method and wet chemical compositions for diffusion barrier formation (2023-12-19),

10. 11807951 - Cobalt chemistry for smooth topology (2023-11-07),

11. 11746433 - Single step electrolytic method of filling through holes in printed circuit boards and other substrates (2023-09-05),

12. 11697884 - Copper deposition in wafer level packaging of integrated circuits (2023-07-11),

13. 11643742 - Silver/tin electroplating bath and method of using the same (2023-05-09),

14. 11566338 - Multicorrosion protection system for decorative parts with chrome finish (2023-01-31),

15. RE49202 - Copper electrodeposition in microelectronics (2022-09-05),

Company Overview

Macdermid Enthone GmbH specializes in advanced surface finishing technologies, providing innovative solutions for various industries including electronics, automotive, and aerospace. The company focuses on developing high-performance coatings and chemical processes that enhance product durability and functionality. With a commitment to research and development, Macdermid Enthone is dedicated to delivering cutting-edge technologies that meet the evolving needs of its global clientele, ensuring quality and sustainability in manufacturing processes.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

41 Patents

#4 in Waterbury, CT

#220 in Connecticut

#8,447 in US

#16,725 in the World

Waterbury, CT, United States of America

Macdermid Enthone Gmbh

Forward Citations = 9

61 inventors:

Kyle M Whitten (15 out of 15 patents)

Vincent Paneccasio, Jr (12 out of 38 patents)

Thomas B Richardson (12 out of 19 patents)

4. Shaopeng Sun (9 out of 9 patents)

5. Elie H Najjar (9 out of 13 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Macdermid Enthone Gmbh. Retrieved from https://idiyas.com/company/macdermid-enthone

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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