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For the Inventor, By the Inventor

Waterbury, CT, United States of America

Macdermid Enthone Gmbh


USPTO Granted Patents = 41


Trademarks = 38

Forward Citations = 9

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61 inventors (with patents filed for the assignee):

goldMedal Kyle M Whitten (15 out of 15 patents)

silverMedal Vincent Paneccasio, Jr (12 out of 38 patents)

bronzeMedal Thomas B Richardson (12 out of 19 patents)

4.  Shaopeng Sun (9 out of 9 patents)

5.  Elie H Najjar (9 out of 13 patents)

6.  John Commander (6 out of 8 patents)

7.  Jianwen Han (6 out of 6 patents)

8.  Wenbo Shao (6 out of 6 patents)

9.  Richard W Hurtubise (6 out of 29 patents)

10.  Ernest Long (5 out of 12 patents)

11.  Richard A Bellemare (5 out of 8 patents)

12.  Eric Yakobson (5 out of 15 patents)

13.  Stephan I Braye (4 out of 4 patents)

14.  Andreas Konigshofen (4 out of 5 patents)

15.  Fengting Xu (3 out of 4 patents)


Core Competencies:
Electrolytic Method
Copper Deposition
Interconnects
Microelectronics
Nickel Plating
Ozone-Etched Plastics
Nanotwinned Copper
Cobalt Chemistry
Wafer Level Packaging
Corrosion Protection
Flexible Substrates
Conductive Polymers

41 patents:

1. 12635082 - Single step electrolytic method of filling through-holes in printed circuit boards and other substrates (2026-05-19),
2. 12553134 - Bendable nickel plating on flexible substrates (2026-02-17),
3. 12540404 - Method for improving adhesion between metallization layers and ozone-etched plastics (2026-02-03),
4. 12398480 - Leveler compositions for use in copper deposition in manufacture of microelectronics (2025-08-26),
5. 12325927 - Complex waveform for electrolytic plating (2025-06-10),
6. 12270121 - Composition and method for fabrication of nickel interconnects (2025-04-08),
7. 12157944 - Method and wet chemical compositions for diffusion barrier formation (2024-12-03),
8. 11873568 - Compositions and methods for the electrodeposition of nanotwinned copper (2024-01-16),
9. 11846018 - Method and wet chemical compositions for diffusion barrier formation (2023-12-19),
10. 11807951 - Cobalt chemistry for smooth topology (2023-11-07),
11. 11746433 - Single step electrolytic method of filling through holes in printed circuit boards and other substrates (2023-09-05),
12. 11697884 - Copper deposition in wafer level packaging of integrated circuits (2023-07-11),
13. 11643742 - Silver/tin electroplating bath and method of using the same (2023-05-09),
14. 11566338 - Multicorrosion protection system for decorative parts with chrome finish (2023-01-31),
15. RE49202 - Copper electrodeposition in microelectronics (2022-09-05),
Macdermid Enthone GmbH specializes in advanced surface finishing technologies, providing innovative solutions for various industries including electronics, automotive, and aerospace. The company focuses on developing high-performance coatings and chemical processes that enhance product durability and functionality. With a commitment to research and development, Macdermid Enthone is dedicated to delivering cutting-edge technologies that meet the evolving needs of its global clientele, ensuring quality and sustainability in manufacturing processes.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Macdermid Enthone Gmbh
41 Patents

#4 in Waterbury, CT

#220 in Connecticut

#8,427 in US

#16,669 in the World

Waterbury, CT (US)
Waterbury, CT, United States of America

Macdermid Enthone Gmbh

Forward Citations = 9

61 inventors:

goldMedal Kyle M Whitten (15 out of 15 patents)

silverMedal Vincent Paneccasio, Jr (12 out of 38 patents)

bronzeMedal Thomas B Richardson (12 out of 19 patents)

4.  Shaopeng Sun (9 out of 9 patents)

5.  Elie H Najjar (9 out of 13 patents)

Please report any incorrect information to [email protected]
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