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Langenfeld, Germany

Macdermid Enthone Gmbh

USPTO Granted Patents = 38

EPO Patents = 33

Trademarks = 44

Forward Citations = 9

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56 inventors (with patents filed for the assignee):

Kyle M Whitten (15 out of 15 patents)

Vincent Paneccasio, Jr (12 out of 38 patents)

Thomas B Richardson (12 out of 19 patents)

4. Shaopeng Sun (9 out of 9 patents)

5. Elie H Najjar (9 out of 13 patents)

6. John Commander (6 out of 8 patents)

7. Jianwen Han (6 out of 6 patents)

8. Wenbo Shao (6 out of 6 patents)

9. Richard W Hurtubise (6 out of 29 patents)

10. Eric Yakobson (5 out of 15 patents)

11. Stephan I Braye (4 out of 4 patents)

12. Ernest Long (4 out of 11 patents)

13. Richard A Bellemare (4 out of 7 patents)

14. Andreas Konigshofen (4 out of 5 patents)

15. Fengting Xu (3 out of 4 patents)

38 patents: Sort by Forward Citations

1. 12398480 - Leveler compositions for use in copper deposition in manufacture of microelectronics (2025-08-26),

2. 12325927 - Complex waveform for electrolytic plating (2025-06-10),

3. 12270121 - Composition and method for fabrication of nickel interconnects (2025-04-08),

4. 12157944 - Method and wet chemical compositions for diffusion barrier formation (2024-12-03),

5. 11873568 - Compositions and methods for the electrodeposition of nanotwinned copper (2024-01-16),

6. 11846018 - Method and wet chemical compositions for diffusion barrier formation (2023-12-19),

7. 11807951 - Cobalt chemistry for smooth topology (2023-11-07),

8. 11746433 - Single step electrolytic method of filling through holes in printed circuit boards and other substrates (2023-09-05),

9. 11697884 - Copper deposition in wafer level packaging of integrated circuits (2023-07-11),

10. 11643742 - Silver/tin electroplating bath and method of using the same (2023-05-09),

11. 11566338 - Multicorrosion protection system for decorative parts with chrome finish (2023-01-31),

12. RE49202 - Copper electrodeposition in microelectronics (2022-09-05),

13. 11434578 - Cobalt filling of interconnects in microelectronics (2022-09-06),

14. 11401618 - Cobalt filling of interconnects (2022-08-02),

15. 11384446 - Compositions and methods for the electrodeposition of nanotwinned copper (2022-07-12),

MacDermid Enthone GmbH is a global specialty chemicals company specializing in providing innovative surface finishing technologies. With a history stretching back over a century, MacDermid Enthone has established itself as a leader in the industry, delivering high-performance solutions for applications in electronics, automotive, aerospace, and many other sectors. Their dedicated team of experts works closely with customers to understand their specific requirements and develop tailored solutions to meet their needs. Through continuous innovation and investment in research and development, MacDermid Enthone remains at the forefront of technological advancement, consistently delivering superior quality and value to its customers worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

38 Patents

#1 in Langenfeld

#1,353 in Germany

#17,301 in the World

Langenfeld, Germany

Macdermid Enthone Gmbh

Forward Citations = 9

56 inventors:

Kyle M Whitten (15 out of 15 patents)

Vincent Paneccasio, Jr (12 out of 38 patents)

Thomas B Richardson (12 out of 19 patents)

4. Shaopeng Sun (9 out of 9 patents)

5. Elie H Najjar (9 out of 13 patents)

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