The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Jan. 31, 2020
Applicant:

Macdermid Enthone Inc., Waterbury, CT (US);

Inventors:

Eric Yakobson, East Haven, CT (US);

Shaopeng Sun, Orange, CT (US);

Elie Najjar, Norwood, MA (US);

Thomas Richardson, Killingworth, CT (US);

Vincent Paneccasio, Jr., Madison, CT (US);

Wenbo Shao, Stamford, CT (US);

Kyle Whitten, Cheshire, CT (US);

Assignee:

MacDermid Enthone Inc., Waterbury, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/18 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); C25D 21/10 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C25D 3/18 (2013.01); C25D 5/02 (2013.01); C25D 7/123 (2013.01); C25D 21/10 (2013.01); H01L 21/2885 (2013.01); H01L 21/76877 (2013.01);
Abstract

A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.


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