The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Sep. 29, 2023
Applicant:

Macdermid Enthone Inc., Waterbury, CT (US);

Inventors:

Aparna Iyer, Unionville, CT (US);

Ernest Long, Burlington, CT (US);

Kishore Viswanathan, Unionville, CT (US);

Assignee:

MacDermid Enthone Inc., Waterbury, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/00 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/36 (2006.01);
U.S. Cl.
CPC ...
C23C 18/36 (2013.01); C23C 18/1637 (2013.01); C23C 18/1641 (2013.01); C23C 18/1651 (2013.01); C23C 18/1879 (2013.01);
Abstract

A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel phosphorus plating solution comprising (i) a source of nickel ions; (ii) a source of hypophosphite ions; (iii) at least one complexing agent; and (iv) an organic flex additive. The nickel phosphorus plating layer deposited on the substrate exhibits a columnar grain structure.


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