The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Jun. 07, 2022
Applicant:
Macdermid Enthone Inc., Waterbury, CT (US);
Inventors:
Kyle M. Whitten, Cheshire, CT (US);
Stephan I. Braye, West Haven, CT (US);
Jianwen Han, Southbury, CT (US);
Pingping Ye, Bethany, CT (US);
Thomas B. Richardson, Killingworth, CT (US);
Elie H. Najjar, Norwood, MA (US);
Assignee:
MacDermid Enthone Inc., Waterbury, CT (US);
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 5/00 (2006.01); B82Y 40/00 (2011.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 5/605 (2020.08); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01);
Abstract
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.