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For the Inventor, By the Inventor

Xihu, Taiwan

Xin-Hua Huang

This inventor holds 69 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Bonding (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., National Taiwan University. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xin-Hua Huang. Retrieved from https://idiyas.com/inventor/xin-hua-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 69 

% Patents Active = 76.8

Average Co-Inventor Count = 4.5

ph-index = 12

Forward Citations = 1,191(Granted Patents)

Forward Citations (Not Self Cited) = 1,070(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Kihu Township, TW (2017)
  • Xihu Township, Changhua County, TW (2013 - 2018)
  • Changhua County, TW (2012 - 2019)
  • Hsinchu, TW (2023)
  • Xihu Township, TW (2014 - 2024)

Company Filing History:

goldMedal68 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 1,392 
 
National Taiwan University
 patents

Years Active: 2012-2026

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Areas of Expertise:
Semiconductor Bonding
Wafer Stacking
MEMS Sensitivity
3D Trench Capacitor
High Accuracy Patterning
Hybrid Bonding
Surface Activation
Alignment Systems
Substrate Loss Reduction
Thin-Film Transfer
Bond Wave Propagation
Integrated Passive Devices
69 patents (USPTO):Explore Patents
1. 12619037 - Integrated circuit device facilitating same-side optical and electrical testing (2026-05-05),
2. 12334475 - 3D trench capacitor for integrated passive devices (2025-06-17),
3. 12289979 - Deposition system for high accuracy patterning (2025-04-29),
4. 12255062 - Integrate rinse module in hybrid bonding platform (2025-03-18),
5. 12211727 - Simultaneous bonding approach for high quality wafer stacking (2025-01-28),
6. 12148706 - Substrate loss reduction for semiconductor devices (2024-11-19),
7. 12139399 - Conductive bond structure to increase membrane sensitivity in MEMS device (2024-11-12),
8. 11862612 - 3D trench capacitor for integrated passive devices (2024-01-02),
9. 11854999 - Patterning a transparent wafer to form an alignment mark in the transparent wafer (2023-12-26),
10. 11854795 - Integrate rinse module in hybrid bonding platform (2023-12-26),
11. 11851318 - MEMS device and method for making the same (2023-12-26),
12. 11818944 - Deposition system for high accuracy patterning (2023-11-14),
13. 11742321 - Apparatus for bond wave propagation control (2023-08-29),
14. 11721637 - Patterning a transparent wafer to form an alignment mark in the transparent wafer (2023-08-08),
15. 11652058 - Substrate loss reduction for semiconductor devices (2023-05-16),

Title: The Innovative Journey of Xin-Hua Huang

Introduction:

Xin-Hua Huang, a talented inventor hailing from Xihu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Xin-Hua Huang's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology, and renewable energy solutions.

Career Highlights:

With a career spanning over two decades, Xin-Hua Huang has worked with top tech companies in Taiwan, leading research teams and spearheading projects that have revolutionized various industries. His expertise in machine learning and data analytics has led to the development of innovative products that have garnered international acclaim.

Collaborations:

Xin-Hua Huang has collaborated with renowned universities and research institutions worldwide, fostering a culture of innovation and knowledge-sharing. His partnerships have resulted in the creation of patented technologies that have paved the way for a more sustainable and interconnected future.

Conclusion:

In conclusion, Xin-Hua Huang's passion for innovation and his relentless pursuit of excellence have established him as a visionary inventor in the global tech community. His contributions continue to inspire the next generation of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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