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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12255062 B1

PDFFull Text
Date of Patent:
Mar. 18, 2025

Filed:

Nov. 14, 2023

Integrate rinse module in hybrid bonding platform

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Xin-Hua Huang, Xihu Township, TW;

Ping-Yin Liu, Yonghe, TW;

Hung-Hua Lin, Taipei, TW;

Hsun-Chung Kuang, Hsinchu, TW;

Yuan-Chih Hsieh, Hsinchu, TW;

Lan-Lin Chao, Sindian, TW;

Chia-Shiung Tsai, Hsinchu, TW;

Xiaomeng Chen, Baoshan Township, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 20/02 (2006.01); B23K 20/233 (2006.01); B23K 20/24 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02068 (2013.01); B23K 1/0016 (2013.01); B23K 1/206 (2013.01); B23K 20/026 (2013.01); B23K 20/233 (2013.01); B23K 20/24 (2013.01); H01L 24/89 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 2224/80894 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80986 (2013.01);
Abstract

A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.

Find Patent Forward Citations

Huang, Xin-Hua. (2025). Integrate rinse module in hybrid bonding platform (U.S. Patent No. 12255062). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12255062

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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