Hung-Hua Lin

This inventor holds 46 USPTO granted patents and 7 published patent applications, primarily in MEMS Technology. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2026.

USPTO Granted Patents = 46 (Patent Applications = 7)

% Patents Active = 82.6

Average Co-Inventor Count = 4.8

ph-index = 6

Forward Citations = 378(Granted Patents)

Company Filing History:

46 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2026

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Areas of Expertise:

MEMS Device

Hybrid Bonding

Outgassing Material

Biological Sensing

Conductive Bond Structure

Surface Roughness

Aluminum Nitride

Pressure Adjustment

Wafer Level Packaging

Anti-Stiction Coating

Semiconductor Structure

Debonding Schemes

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12698201 - Semiconductor structure and manufacturing method for the same (2026-08-04),

2. 12255062 - Integrate rinse module in hybrid bonding platform (2025-03-18),

3. 12234141 - Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same (2025-02-25),

4. 12185631 - Pizoelectric MEMS device with electrodes having low surface roughness (2024-12-31),

5. 12139399 - Conductive bond structure to increase membrane sensitivity in MEMS device (2024-11-12),

6. 12134824 - Undercut-free patterned aluminum nitride structure and methods for forming the same (2024-11-05),

7. 11932534 - MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion (2024-03-19),

8. 11854795 - Integrate rinse module in hybrid bonding platform (2023-12-26),

9. 11827513 - Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same (2023-11-28),

10. 11812664 - Pizoelectric MEMS device with electrodes having low surface roughness (2023-11-07),

11. 11634318 - MEMs using outgassing material to adjust the pressure level in a cavity (2023-04-25),

12. 11371133 - Undercut-free patterned aluminum nitride structure and methods for forming the same (2022-06-28),

13. 11292715 - Conductive bond structure to increase membrane sensitivity in MEMS device (2022-04-05),

14. 11282697 - Integrate rinse module in hybrid bonding platform (2022-03-22),

15. 11279615 - Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer (2022-03-22),

Title: The Innovative Journey of Inventor Hung-Hua Lin

Introduction: Hung-Hua Lin, a talented inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Hung-Hua Lin's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology for energy efficiency, and wearable health monitoring devices.

Career Highlights: With a career spanning over two decades, Hung-Hua Lin has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to numerous successful product launches.

Collaborations: Throughout his career, Hung-Hua Lin has collaborated with top researchers from universities and research institutions worldwide, fostering a culture of innovation and knowledge sharing.

Conclusion: Hung-Hua Lin's passion for pushing the boundaries of technology and his relentless pursuit of innovation continue to inspire the next generation of inventors and entrepreneurs in Taipei and beyond.