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For the Inventor, By the Inventor

Taipei, Taiwan

Hung-Hua Lin

USPTO Granted Patents = 45 

Average Co-Inventor Count = 5.0

ph-index = 6

Forward Citations = 340(Granted Patents)


Company Filing History:

goldMedal45 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
Hybrid Bonding
Micro-Electro Mechanical Systems
Piezoelectric MEMS
Conductive Bond Structures
Aluminum Nitride Structures
Semiconductor Manufacturing
Biological Sensing Structures
Wafer Level Packaging
Getter Efficiency
Surface Roughness Control
Debonding Schemes
Anti-Stiction Coatings
45 patents (USPTO):Explore Patents
1. 12255062 - Integrate rinse module in hybrid bonding platform (2025-03-18),
2. 12234141 - Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same (2025-02-25),
3. 12185631 - Pizoelectric MEMS device with electrodes having low surface roughness (2024-12-31),
4. 12139399 - Conductive bond structure to increase membrane sensitivity in MEMS device (2024-11-12),
5. 12134824 - Undercut-free patterned aluminum nitride structure and methods for forming the same (2024-11-05),
6. 11932534 - MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion (2024-03-19),
7. 11854795 - Integrate rinse module in hybrid bonding platform (2023-12-26),
8. 11827513 - Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same (2023-11-28),
9. 11812664 - Pizoelectric MEMS device with electrodes having low surface roughness (2023-11-07),
10. 11634318 - MEMs using outgassing material to adjust the pressure level in a cavity (2023-04-25),
11. 11371133 - Undercut-free patterned aluminum nitride structure and methods for forming the same (2022-06-28),
12. 11292715 - Conductive bond structure to increase membrane sensitivity in MEMS device (2022-04-05),
13. 11282697 - Integrate rinse module in hybrid bonding platform (2022-03-22),
14. 11279615 - Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer (2022-03-22),
15. 11180363 - Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same (2021-11-23),

Title: The Innovative Journey of Inventor Hung-Hua Lin

Introduction: Hung-Hua Lin, a talented inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Hung-Hua Lin's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology for energy efficiency, and wearable health monitoring devices.

Career Highlights: With a career spanning over two decades, Hung-Hua Lin has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to numerous successful product launches.

Collaborations: Throughout his career, Hung-Hua Lin has collaborated with top researchers from universities and research institutions worldwide, fostering a culture of innovation and knowledge sharing.

Conclusion: Hung-Hua Lin's passion for pushing the boundaries of technology and his relentless pursuit of innovation continue to inspire the next generation of inventors and entrepreneurs in Taipei and beyond.

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