logo

For the Inventor, By the Inventor

Payson, AZ, United States of America

William G McDonald

This inventor holds 21 USPTO granted patents and 1 published patent application, primarily in Pressure Sensors. Top assignees: Freescale Semiconductor,inc., Motorola Corporation, Other. Active years: 1978-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William G McDonald. Retrieved from https://idiyas.com/inventor/william-g-mcdonald

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 38.1

Average Co-Inventor Count = 2.4

ph-index = 10

Forward Citations = 329(Granted Patents)


Location History:

  • Bronx, NY (US) (1978)
  • Phoenix, AZ (US) (2001)
  • Scottsdale, AZ (US) (2004 - 2010)
  • Payson, AZ (US) (2011 - 2015)

Company Filing History:

goldMedal17 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
silverMedal2 out of 20,290 
 
Motorola Corporation
 patents
bronzeMedal2 out of 834,601 
Other
 patents

Years Active: 1978-2015

Loading Chart...
Areas of Expertise:
Capacitive Pressure Sensor
Dual Port Pressure Sensor
Pressure Sensor Device
QFN Packages
MEMS Technology
Sealing Structure
Flowmeter
Sensor Fabrication
Thermal Management
Solid State Pressure Gauge
Wafer Level Packaging
Differential Pressure
21 patents (USPTO):Explore Patents
1. 9146170 - Capacitive pressure sensor in an overmolded package (2015-09-29),
2. 9021689 - Method of making a dual port pressure sensor (2015-05-05),
3. 8742555 - Lead frame having a flag with in-plane and out-of-plane mold locking features (2014-06-03),
4. 8686550 - Method and apparatus for high pressure sensor device (2014-04-01),
5. 8476087 - Methods for fabricating sensor device package using a sealing structure (2013-07-02),
6. 8384168 - Sensor device with sealing structure (2013-02-26),
7. 8359927 - Molded differential PRT pressure sensor (2013-01-29),
8. 8307714 - Dual port pressure sensor (2012-11-13),
9. 7900521 - Exposed pad backside pressure sensor package (2011-03-08),
10. 7713781 - Methods for forming quad flat no-lead (QFN) packages (2010-05-11),
11. 7652357 - Quad flat no-lead (QFN) packages (2010-01-26),
12. 7489026 - Methods and apparatus for a Quad Flat No-Lead (QFN) package (2009-02-10),
13. 7437951 - Method of using a differential pressure type flowmeter (2008-10-21),
14. 7316965 - Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level (2008-01-08),
15. 7261003 - Flowmeter and method for the making thereof (2007-08-28),

Title: The Innovative Journey of William G McDonald

Introduction: William G McDonald, a talented inventor hailing from Payson, Arizona, has made significant contributions to the world of innovation with his creative mind and dedication to problem-solving.

Latest Patents: William G McDonald's latest patents showcase his commitment to developing cutting-edge solutions in various industries, from technology to healthcare. His most recent inventions focus on improving efficiency and enhancing user experience.

Career Highlights: Throughout his illustrious career, William G McDonald has been recognized for his groundbreaking inventions that have revolutionized the way we live and work. His innovative spirit has led to the creation of patents that have had a lasting impact on society.

Collaborations: William G McDonald has collaborated with leading experts in the field to bring his inventions to life. His partnerships with top companies, research institutions, and universities have been instrumental in turning his ideas into reality and bringing them to the market.

Conclusion: In conclusion, William G McDonald's passion for innovation and his relentless pursuit of excellence have solidified his position as a prominent inventor in the industry. His remarkable contributions continue to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…