The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Feb. 13, 2012
William G. Mcdonald, Payson, AZ (US);
Alexander M. Arayata, Gilbert, AZ (US);
Philip H. Bowles, Fountain Hills, AZ (US);
Stephen R. Hooper, Mesa, AZ (US);
William G. McDonald, Payson, AZ (US);
Alexander M. Arayata, Gilbert, AZ (US);
Philip H. Bowles, Fountain Hills, AZ (US);
Stephen R. Hooper, Mesa, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.