The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7652357 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 26, 2010

Filed:

Jan. 08, 2009
Applicants:

James J. Wang, Phoenix, AZ (US);

William G. Mcdonald, Scottsdale, AZ (US);

Inventors:

James J. Wang, Phoenix, AZ (US);

William G. McDonald, Scottsdale, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material.


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Wang, James. (2010). Quad flat no-lead (qfn) packages (U.S. Patent No. 7652357). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7652357

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