James J Wang

Title: Innovations of James J Wang in Semiconductor Packaging

Introduction

James J Wang is a notable inventor based in Phoenix, AZ, who has made significant contributions to the field of semiconductor packaging. With a total of four patents to his name, Wang has focused on developing advanced methods for forming Quad Flat No-Lead (QFN) packages, which are essential in modern electronic devices.

Latest Patents

Wang's latest patents include innovative methods for forming QFN packages. One embodiment describes a process that involves disposing an active side of a semiconductor chip on a plurality of leads. It also details the coupling of wire bonds to the active side and leads, followed by encasing the semiconductor chip and leads in a mold material. This design ensures that the mounting side of the QFN package has a well-defined perimeter, with leads oriented and exposed appropriately. Another patent further elaborates on the structure of QFN packages, emphasizing the arrangement of the semiconductor chip, wire bonds, and mold material to optimize performance.

Career Highlights

James J Wang is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in enhancing the efficiency and reliability of electronic components used in various applications.

Collaborations

Wang has collaborated with notable colleagues such as William G McDonald and Alan J Magnus, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

James J Wang's contributions to semiconductor packaging through his patents and work at Freescale Semiconductor, Inc. highlight his role as a key innovator in the industry. His advancements in QFN package technology are paving the way for future developments in electronics.