The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Aug. 30, 2011
Applicants:
Jian Wen, Chandler, AZ (US);
Darrel R. Frear, Phoenix, AZ (US);
William G. Mcdonald, Payson, AZ (US);
Inventors:
Jian Wen, Chandler, AZ (US);
Darrel R. Frear, Phoenix, AZ (US);
William G. McDonald, Payson, AZ (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/62 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/49544 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00 (2013.01);
Abstract
A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.