Jian Wen

Title: Innovations by Inventor Jian Wen

Introduction

Jian Wen is an accomplished inventor based in Chandler, AZ, with a notable portfolio of three patents. His work primarily focuses on advancements in semiconductor technology and pressure sensing devices.

Latest Patents

One of his latest patents is for a capacitive pressure sensor in an overmolded package. This innovative design enhances the rigidity of the pressure sensor die, allowing it to withstand stress effects from the molding encapsulant. The cap of the pressure sensor die includes a strategically placed hole that enables external gas pressure to be experienced while directing moisture away from the diaphragm. This design eliminates the need for gel, allowing for a soft film to be deposited on the diaphragm for moisture protection if necessary.

Another significant patent is for a lead frame for a semiconductor package with enhanced stress relief. This semiconductor package features a lead frame, a semiconductor die, and bond wires that provide electrical connections. The lead frame is designed with spaced apart frame members and lead pads, ensuring that the die is securely mounted and protected within the mold compound.

Career Highlights

Jian Wen has worked with Freescale Semiconductor, where he contributed to various innovative projects. His experience in the semiconductor industry has allowed him to develop cutting-edge technologies that enhance device performance and reliability.

Collaborations

Throughout his career, Jian has collaborated with notable professionals, including William G. McDonald and Darrel R. Frear. These collaborations have further enriched his work and contributed to the success of his inventions.

Conclusion

Jian Wen's contributions to the field of semiconductor technology and pressure sensing devices demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of engineering principles and a dedication to improving device functionality.