Fremont, CA, United States of America

William Dinan Hinsberg

This inventor holds 24 USPTO granted patents and 2 EPO patents, primarily in Lithography Technology. Top assignees: International Business Machines Corporation, Jsr Corporation, Other. Active years: 1997-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Dinan Hinsberg. Retrieved from https://idiyas.com/inventor/william-dinan-hinsberg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 70.8


Average Co-Inventor Count = 3.5

ph-index = 10

Forward Citations = 930(Granted Patents)


Location History:

  • San Jose, CA (US) (2009 - 2012)
  • Fremont, CA (US) (1997 - 2014)

Company Filing History:


Years Active: 1997-2014

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Areas of Expertise:
Photoresist
Lithographic Patterning
Directed Self-Assembly
Immersion Topcoat
Polymer Features
Chemical Compounds
Optical Proximity Correction
Fluoroalcohol Materials
Layered Structures
Sublithographic Structures
Patterned Polymers
24 patents (USPTO):Explore Patents

Title: Innovations and Contributions of William Dinan Hinsberg

Introduction

William Dinan Hinsberg is a notable inventor based in Fremont, California, recognized for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 24 patents, he has played a crucial role in advancing the methodologies and materials used in lithography and the fabrication of semiconductor devices.

Latest Patents

Among his latest innovations is the patent for a positive tone organic solvent developed for chemically amplified resist. This invention presents a method for developing positive-tone chemically amplified resists using an organic developer solvent that includes at least one polyhydric alcohol, such as ethylene glycol or glycerol. This capability significantly enhances lithography pattern forming processes, especially for producing integrated circuits (IC) and applications where traditional solvents lack suitability, particularly in the fabrication of chips patterned with biomolecules or in deprotection applications.

Another notable patent involves methods for directed self-assembly and the creation of layered structures formed therefrom. This innovation outlines methods for creating a layered structure utilizing a self-assembled material, where an initial patterned photoresist layer is treated to become insoluble in a suitable organic solvent for the casting of self-assembly materials. This advancement is pivotal for streamlining processes in semiconductor fabrication and microfabrication technologies.

Career Highlights

Throughout his career, Hinsberg has worked with esteemed companies, including IBM and JSR Corporation, where he has applied his expertise in push innovations within the semiconductor industry. His role in these organizations has allowed him to develop cutting-edge technologies that continue to shape the future of lithography and device manufacturing.

Collaborations

Collaborating with prominent professionals such as Gregory Michael Wallraff and Joy Cheng, Hinsberg has been part of a network of innovative thinkers driving progress within the field. These partnerships have further propelled the reach and impact of his inventions, ensuring that they address the complex challenges faced in semiconductor manufacturing.

Conclusion

William Dinan Hinsberg's contributions to the field of semiconductor technology and his extensive patent portfolio underscore his role as a pivotal inventor. Through his innovative solutions and collaborative efforts, he has significantly advanced methods that enhance the efficiency and effectiveness of semiconductor device fabrication, solidifying his legacy within the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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