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For the Inventor, By the Inventor

Taipei, Taiwan

Wen-Yuan Chang

This inventor holds 37 USPTO granted patents and 1 EPO patent, primarily in Chip Packaging. Top assignees: Via Technologies, Inc., Via Alliance Semiconductor Co., Ltd., Transpacific IP Limited. Active years: 2002-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Yuan Chang. Retrieved from https://idiyas.com/inventor/wen-yuan-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 37

% Patents Active = 89.2


Average Co-Inventor Count = 1.9

ph-index = 8

Forward Citations = 216(Granted Patents)


Location History:

  • Hsin-Tien, TW (2003 - 2008)
  • Taipei, TW (2002 - 2009)
  • Hsinchu, TW (2005 - 2009)
  • Taipei Hsien, TW (2003 - 2014)
  • New Taipei, TW (2014 - 2022)

Company Filing History:

goldMedal22 out of 1,975 
 
Via Technologies, Inc.
 patents
silverMedal5 out of 283 
 
Via Alliance Semiconductor Co., Ltd.
 patents
bronzeMedal3 out of 67 
 
Transpacific IP Limited
 patents
4. 2 out of 4,577 
 
Au Optronics Corporation
 patents
5. 2 out of 169 
 
Shanghai Zhaoxin Semiconductor Co., Ltd.
 patents
6. 1 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
7. 2 out of 834,513 
Other
 patents

Years Active: 2002-2025

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Areas of Expertise:
Chip Package
Probe Card
Circuit Substrate
Electronic Structure
Integrated Circuit
Fabrication Method
Coreless Package
Optical Module
Resistive Memory
Grid Array
Shock Absorbent
Flip Chip
37 patents (USPTO):Explore Patents
1. 12506060 - Package substrate, chip package and integrated circuit chip (2025-12-23),
2. 11227848 - Chip package array, and chip package (2022-01-18),
3. 11081371 - Chip package process (2021-08-03),
4. 10756077 - Chip packaging method (2020-08-25),
5. 10504847 - Chip package structure and chip package structure array (2019-12-10),
6. 10459007 - Probe card (2019-10-29),
7. 10184956 - Probe card (2019-01-22),
8. 10119995 - Probe card (2018-11-06),
9. 10002839 - Electronic structure, and electronic structure array (2018-06-19),
10. 9905519 - Electronic structure process (2018-02-27),
11. 9788425 - Electronic package assembly (2017-10-10),
12. 9425066 - Circuit substrate (2016-08-23),
13. 9418964 - Chip package structure (2016-08-16),
14. 9324580 - Process for fabricating a circuit substrate (2016-04-26),
15. 8796848 - Circuit board and chip package structure (2014-08-05),

Title: The Innovative Journey of Wen-Yuan Chang

Introduction: Wen-Yuan Chang, a pioneering inventor hailing from New Taipei, TW, is a trailblazing woman in the world of innovation and patents.

Latest Patents: Chang's recent patents showcase her commitment to cutting-edge solutions in various industries, including technology, healthcare, and sustainability.

Career Highlights: With a career spanning over two decades, Chang has consistently pushed the boundaries of traditional thinking, leading to groundbreaking inventions that have revolutionized their respective fields.

Collaborations: Throughout her career, Chang has collaborated with top-tier research institutions, leading companies, and visionary inventors, fostering a culture of innovation and excellence.

Conclusion: Wen-Yuan Chang's remarkable journey as an inventor exemplifies the power of creativity, perseverance, and collaboration in shaping a better future for industries and society as a whole.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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