The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Jun. 29, 2017
Applicant:

Via Alliance Semiconductor Co., Ltd., Shanghai, CN;

Inventors:

Wen-Yuan Chang, New Taipei, TW;

Wei-Cheng Chen, New Taipei, TW;

Chen-Yueh Kung, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/04 (2014.01); H01L 27/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/04 (2013.01); H01L 24/14 (2013.01); H01L 25/04 (2013.01); H01L 27/00 (2013.01);
Abstract

An electronic structure process includes the following steps. A redistribution structure and a carrier plate are provided. A plurality of first bonding protruding portions and a first supporting structure are formed on the redistribution structure. A first encapsulated material is formed and filled between a first opening and the first bonding protruding portions. The carrier plate is removed. A plurality of second bonding protruding portions and a second supporting structure are formed on the redistribution structure. A second encapsulated material is formed and filled between a second opening and the second bonding protruding portions.


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