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For the Inventor, By the Inventor

Taipei, Taiwan

Wei-Cheng Chen

This inventor holds 29 USPTO granted patents and 5 published patent applications, primarily in Chip Packaging. Top assignees: Hon Hai Precision Industry Co., Ltd., Via Technologies, Inc., Industrial Technology Research Institute. Active years: 2002-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Cheng Chen. Retrieved from https://idiyas.com/inventor/wei-cheng-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 89.7

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 60(Granted Patents)


Location History:

  • Chang-Hua, TW (2002)
  • Taipei Hsien, TW (2011 - 2014)
  • Hsinchu, TW (2006 - 2017)
  • Hsinchu County, TW (2018)
  • Tu-Cheng, TW (2018)
  • New Taipei, TW (2015 - 2022)

Company Filing History:

goldMedal6 out of 19,792 
 
Hon Hai Precision Industry Co., Ltd.
 patents
silverMedal6 out of 1,975 
 
Via Technologies, Inc.
 patents
bronzeMedal5 out of 9,303 
 
Industrial Technology Research Institute
 patents
4. 4 out of 283 
 
Via Alliance Semiconductor Co., Ltd.
 patents
5. 2 out of 292 
 
Chicony Electronics Co., Ltd.
 patents
6. 2 out of 169 
 
Shanghai Zhaoxin Semiconductor Co., Ltd.
 patents
7. 2 out of 2,595 
 
Synopsys, Inc.
 patents
8. 1 out of 535 
 
Asia Vital Components Co., Ltd.
 patents
9. 1 out of 2 
 
Industrial Technical Research Institute
 patents
10. 1 out of 1 
 
Taiwan Cement Corporation
 patent
where one patent can have more than one assignee

Years Active: 2002-2022

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Areas of Expertise:
Camera Module
Array Substrate
Display Panel
Chip Package
Circuit Board
Probe Card
Electronic Structure
Touch Display Device
Magnetic Suspension Bearing
DVD-RAM Disc
Fabrication Method
Waterproof Motor Stator
29 patents (USPTO):Explore Patents
1. 11445092 - Camera module (2022-09-13),
2. 11227848 - Chip package array, and chip package (2022-01-18),
3. 11226528 - Array substrate for reducing parasitic capacitance between adjacent wires, display panel, and display device (2022-01-18),
4. 11217139 - Display panel, gate scanning circuit, and gate scanning unit circuit (2022-01-04),
5. 11081371 - Chip package process (2021-08-03),
6. 10962851 - Array substrate, display panel and display device (2021-03-30),
7. 10890794 - Display device (2021-01-12),
8. 10756077 - Chip packaging method (2020-08-25),
9. 10701807 - Multi-layer circuit board structure (2020-06-30),
10. 10504847 - Chip package structure and chip package structure array (2019-12-10),
11. 10459007 - Probe card (2019-10-29),
12. 10184956 - Probe card (2019-01-22),
13. 10152482 - Method of speeding up access to design databases having large numbers of design units (2018-12-11),
14. 10119995 - Probe card (2018-11-06),
15. 10002839 - Electronic structure, and electronic structure array (2018-06-19),

Title: Wei-Cheng Chen: Pioneering Inventor from New Taipei

Introduction: Wei-Cheng Chen is a distinguished inventor hailing from New Taipei, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Wei-Cheng Chen holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his versatility and ingenuity in inventing cutting-edge solutions.

Career Highlights: Throughout his illustrious career, Wei-Cheng Chen has worked with leading tech companies, research institutions, and universities, where he has spearheaded numerous projects that have pushed the boundaries of technological advancement.

Collaborations: Wei-Cheng Chen has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing that has led to the development of revolutionary products and technologies.

Conclusion: Wei-Cheng Chen's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a trailblazer in the world of inventions, inspiring the next generation of inventors to dream big and think outside the box.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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