Shanghai, China

Via Alliance Semiconductor Co., Ltd.


USPTO Granted Patents = 283


Forward Citations = 637

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169 inventors (with patents filed for the assignee):

goldMedal G Glenn Henry (105 out of 379 patents)

silverMedal Colin Eddy (47 out of 75 patents)

bronzeMedal Terry J Parks (43 out of 275 patents)

4 Gerard M Col (29 out of 73 patents)

5 Rodney E Hooker (28 out of 138 patents)

6 Douglas Raye Reed (27 out of 36 patents)

7 Dinesh K Jain (26 out of 37 patents)

8 Deming Gu (13 out of 22 patents)

9 Yeong-Sheng Lee (12 out of 39 patents)

10 Zhou Hong (12 out of 32 patents)

11 Stephan Gaskins (11 out of 32 patents)

12 Thomas Elmer (9 out of 28 patents)

13 Kim C Houck (8 out of 9 patents)

14 Heng Que (8 out of 11 patents)

15 John Michael Greer (8 out of 18 patents)


Core Competencies:
Cache Memory
Neural Network Unit
Image Quality Improvement
Dynamic Voltage Adjustment
Arithmetic Logic Integration
Data Quantization
Floating-Point Calculation
Virtual Reality Devices
Multi-Resolution Processing
Hybrid Coprocessor
Kernel Enqueuing
3D Convolutions

283 patents:

VIA Alliance Semiconductor Co., Ltd. is a leading semiconductor company specialized in the development, manufacturing, and sale of advanced electronic components. With a focus on providing innovative solutions, VIA Alliance Semiconductor offers a wide range of products, including integrated circuits, system-on-chips (SoCs), and embedded platforms. Our cutting-edge technologies power a variety of applications, from consumer electronics and networking devices to automotive systems and industrial equipment. Committed to excellence in quality and reliability, we strive to deliver the highest performance and efficiency to meet the demands of our global customers.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 9 2025

283 Patents

#12 in Shanghai

#124 in China

#3,032 in the World

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Shanghai, China
Forward Citations = 637

169 inventors:

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