The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Dec. 03, 2015
Applicant:
Via Alliance Semiconductor Co., Ltd., Shanghai, CN;
Inventors:
Assignee:
VIA ALLIANCE SEMICONDUCTOR CO., LTD., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01L 25/00 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 25/00 (2013.01); H05K 1/141 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H05K 1/0204 (2013.01); H05K 1/144 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/10992 (2013.01); Y02P 70/611 (2015.11);
Abstract
An electronic package assembly is provided. The electronic package assembly includes a package substrate having a first surface and a second surface opposite thereto. A plurality of conductive pads is disposed on the first surface. A chip is mounted onto the first surface of the package substrate. A circuit board is mounted onto the second surface of the package substrate, and includes an electrical connector. A plurality of electrical contact components is electrically connected to the electrical connector and is in contact with the plurality of conductive pads.