Wen-Hsin Wei

This inventor holds 31 USPTO granted patents and 4 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2017-2026.

USPTO Granted Patents = 31 (Patent Applications = 4)

% Patents Active = 93.5

Average Co-Inventor Count = 6.3

ph-index = 7

Forward Citations = 275(Granted Patents)

Company Filing History:

29 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 463

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2017-2026

Loading Chart...

31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12677704 - Integrated circuit packages and methods of forming the same (2026-07-07),

2. 12628713 - Giga interposer integration through chip-on-wafer-on-substrate (2026-05-12),

3. 12538835 - Integrated chip package including a crack-resistant lid structure and methods of forming the same (2026-01-27),

4. 12538816 - Package structure having line connected via portions (2026-01-27),

5. 12519094 - Package structure and method of fabricating the same (2026-01-06),

6. 12294002 - Integrated circuit package and method of forming same (2025-05-06),

7. 12094836 - Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof (2024-09-17),

8. 12021006 - Package structure and method and equipment for forming the same (2024-06-25),

9. 12015023 - Integrated circuit package and method of forming same (2024-06-18),

10. 11967546 - Giga interposer integration through Chip-On-Wafer-On-Substrate (2024-04-23),

11. 11923310 - Package structure including through via structures (2024-03-05),

12. 11810833 - Package structure and method and equipment for forming the same (2023-11-07),

13. 11728254 - Giga interposer integration through chip-on-wafer-on-substrate (2023-08-15),

14. 11527454 - Package structures and methods of forming the same (2022-12-13),

15. 11456287 - Package structure and method of fabricating the same (2022-09-27),

Title: Inventor Wen-Hsin Wei: Revolutionizing Technology in Hsinchu

Introduction: Wen-Hsin Wei is a pioneering inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology.

Latest Patents: Wei holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her diverse range of expertise and innovation.

Career Highlights: With a career spanning over two decades, Wen-Hsin Wei has worked with leading tech companies and research institutions, consistently pushing the boundaries of technological advancement.

Collaborations: Throughout her career, Wei has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange in the tech industry.

Conclusion: Wen-Hsin Wei's relentless pursuit of innovation and her significant contributions to technology make her a standout figure in the world of inventors, inspiring future generations to push the boundaries of what is possible in the realm of technology.