The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
May. 22, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shang-Yun Hou, Jubei, TW;
Hsien-Pin Hu, Zhubei, TW;
Sao-Ling Chiu, Hsinchu, TW;
Wen-Hsin Wei, Hsinchu, TW;
Ping-Kang Huang, Chiayi, TW;
Chih-Ta Shen, Hsinchu, TW;
Szu-Wei Lu, Hsinchu, TW;
Ying-Ching Shih, Hsinchu, TW;
Wen-Chih Chiou, Zhunan Township, TW;
Chi-Hsi Wu, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.