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For the Inventor, By the Inventor

Chiayi, Taiwan

Ping-Kang Huang

This inventor holds 24 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ping-Kang Huang. Retrieved from https://idiyas.com/inventor/ping-kang-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 5

Forward Citations = 464(Granted Patents)


Company Filing History:

goldMedal23 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Giga Interposer
Chip-On-Wafer-On-Substrate
3D Integrated Circuits
Board Substrates
Semiconductor Structures
Package Fabrication
Thermal Management
Manufacturing Methods
Interposer Packages
Integrated Fan-Out Packages
Semiconductor Devices
Three-Dimensional Packages
24 patents (USPTO):Explore Patents
1. 12628713 - Giga interposer integration through chip-on-wafer-on-substrate (2026-05-12),
2. 12431435 - Semiconductor packages and methods of forming the same (2025-09-30),
3. 12283541 - Manufacturing method of semiconductor package (2025-04-21),
4. 12170237 - Semiconductor structure and manufacturing method thereof (2024-12-17),
5. 12113027 - Three-dimensional integrated circuit structures and methods of forming the same (2024-10-08),
6. 11967546 - Giga interposer integration through Chip-On-Wafer-On-Substrate (2024-04-23),
7. 11916009 - Semiconductor package and manufacturing method thereof (2024-02-27),
8. 11810793 - Semiconductor packages and methods of forming same (2023-11-07),
9. 11728278 - Board substrates, three-dimensional integrated circuit structures and methods of forming the same (2023-08-15),
10. 11728254 - Giga interposer integration through chip-on-wafer-on-substrate (2023-08-15),
11. 11715675 - Semiconductor device and manufacturing method thereof (2023-08-01),
12. 11552054 - Package structure and method of manufacturing the same (2023-01-10),
13. 11545438 - Semiconductor packages and methods of forming the same (2023-01-03),
14. 11495472 - Semicondutor packages and methods of forming same (2022-11-08),
15. 11373946 - Semiconductor package and manufacturing method thereof (2022-06-28),

Title: Inventor Ping-Kang Huang: Revolutionizing Technology in Chiayi

Introduction: Ping-Kang Huang is a visionary inventor hailing from Chiayi, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Ping-Kang Huang's most recent patents include innovative solutions in the areas of artificial intelligence, renewable energy, and biotechnology.

Career Highlights: With a career spanning over two decades, Huang has established himself as a leading figure in the tech industry, with numerous successful inventions that have shaped the way we interact with technology today.

Collaborations: Throughout his career, Ping-Kang Huang has collaborated with top research institutions, universities, and tech companies worldwide, fostering a culture of innovation and excellence in all his projects.

Conclusion: Ping-Kang Huang's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the field of inventions, with a lasting impact on the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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