Sao-Ling Chiu

This inventor holds 39 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2012-2026.

USPTO Granted Patents = 39 (Patent Applications = 9)

% Patents Active = 92.3

Average Co-Inventor Count = 4.2

ph-index = 6

Forward Citations = 482(Granted Patents)

Company Filing History:

38 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 463

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2012-2026

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Areas of Expertise:

Giga Interposer

Semiconductor Packages

3D Integrated Circuits

Fan-Out Package

Chip-On-Wafer

Conductive Vias

Thermal Management

Process Control

Flexible Substrate

Warpage Improvement

Manufacturing Methods

Board Substrates

39 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12628713 - Giga interposer integration through chip-on-wafer-on-substrate (2026-05-12),

2. 12431435 - Semiconductor packages and methods of forming the same (2025-09-30),

3. 12283541 - Manufacturing method of semiconductor package (2025-04-21),

4. 12170237 - Semiconductor structure and manufacturing method thereof (2024-12-17),

5. 12113027 - Three-dimensional integrated circuit structures and methods of forming the same (2024-10-08),

6. 11967546 - Giga interposer integration through Chip-On-Wafer-On-Substrate (2024-04-23),

7. 11916009 - Semiconductor package and manufacturing method thereof (2024-02-27),

8. 11901306 - Semiconductor structure (2024-02-13),

9. 11810793 - Semiconductor packages and methods of forming same (2023-11-07),

10. 11728278 - Board substrates, three-dimensional integrated circuit structures and methods of forming the same (2023-08-15),

11. 11728254 - Giga interposer integration through chip-on-wafer-on-substrate (2023-08-15),

12. 11715681 - Fan-out package structure and method (2023-08-01),

13. 11715675 - Semiconductor device and manufacturing method thereof (2023-08-01),

14. 11552054 - Package structure and method of manufacturing the same (2023-01-10),

15. 11545438 - Semiconductor packages and methods of forming the same (2023-01-03),

Title: Sao-Ling Chiu: Innovator from Hsinchu

Introduction: Sao-Ling Chiu is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Sao-Ling Chiu's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips for various electronic devices.

Career Highlights: With a career spanning over two decades, Sao-Ling Chiu has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant technological advancements in the industry.

Collaborations: Sao-Ling Chiu has collaborated with top research institutions and universities in Taiwan, fostering a culture of innovation and knowledge-sharing to push the boundaries of technology further.

Conclusion: Sao-Ling Chiu's dedication to innovation and his relentless pursuit of technological excellence continue to inspire the next generation of inventors and researchers in Taiwan and beyond.