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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11527454 B1

PDFFull Text
Date of Patent:
Dec. 13, 2022

Filed:

Jun. 29, 2021

Package structures and methods of forming the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chen-Hua Yu, Hsinchu, TW;

Wen-Hsin Wei, Hsinchu, TW;

Chi-Hsi Wu, Hsinchu, TW;

Shang-Yun Hou, Jubei, TW;

Jing-Cheng Lin, Hsinchu, TW;

Hsien-Pin Hu, Zhubei, TW;

Ying-Ching Shih, Hsinchu, TW;

Szu-Wei Lu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

William A Harriston

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/16 (2006.01); H01L 21/56 (2006.01); H01L 23/14 (2006.01); H01L 21/48 (2006.01); H01L 25/03 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 23/147 (2013.01); H01L 23/16 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/562 (2013.01); H01L 24/05 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 25/03 (2013.01); H01L 25/065 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 23/5389 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01);
Abstract

An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first component in a scribe line region of the first component, adhering a cover structure to a second side of the second die, and singulating the first component and the dummy die to form a package structure.

Find Patent Forward Citations

Yu, Chen-Hua. (2022). Package structures and methods of forming the same (U.S. Patent No. 11527454). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11527454

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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